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Amazon AWS will deploy the Cerebras wafer-scale AI chip CS-3, to be used in conjunction with their own Trainium.
IT House March 16 News, Amazon AWS and wafer-level AI chip company Cerebras announced on the US local time of the 13th that Amazon’s Amazon Bedrock platform will deploy a hybrid AI inference system combining both companies’ chip products in the coming months, delivering the fastest load processing speed.
This solution will combine Cerebras’ CS-3 system, Amazon AWS’s Trainium chips, and Amazon AWS’s EFA elastic network adapters. Trainium chips will handle inference pre-filling (prompt processing), while CS-3 will handle decoding (output generation tasks). The two are connected via EFA.
IT House understands that inference pre-filling is a parallel workload requiring high computing power and moderate memory bandwidth; inference decoding is essentially serial, with lower computing power requirements but higher memory bandwidth needs. Using Trainium and CS-3 together can leverage the strengths of both AI chips to provide the best end-user experience.