Data Kin On September 4th, Li Ji announced that its multi-layer wafer stacking technology has been adopted by major factories such as AMD. Combined with the advanced logic process of wafer foundries, it has developed high-frequency, high-capacity, low-power 3DAI chips.
Halaman ini mungkin berisi konten pihak ketiga, yang disediakan untuk tujuan informasi saja (bukan pernyataan/jaminan) dan tidak boleh dianggap sebagai dukungan terhadap pandangannya oleh Gate, atau sebagai nasihat keuangan atau profesional. Lihat Penafian untuk detailnya.
Kekuatan Integral Elektrik: Teknologi tumpukan wafer multi-lapisan diadopsi oleh AMD, mengembangkan chip AI 3D
Data Kin On September 4th, Li Ji announced that its multi-layer wafer stacking technology has been adopted by major factories such as AMD. Combined with the advanced logic process of wafer foundries, it has developed high-frequency, high-capacity, low-power 3DAI chips.